加速海外业务拓展，鼎龙股份筹划港股上市

Group 1 - The core point of the news is that Dinglong Co., Ltd. is planning to issue H-shares and list on the Hong Kong Stock Exchange to enhance its global strategy in the innovative materials sector and accelerate overseas business expansion [1] - The company aims to deepen its international influence and competitiveness through this H-share issuance, which will not change the control of its major shareholders [1] - The company has established itself as a leading platform in the innovative materials sector, particularly in semiconductor materials, and is focusing on expanding its overseas market presence [1] Group 2 - Financial data shows that the semiconductor business of the company has maintained strong growth, with a revenue of 1.534 billion yuan in the first three quarters of 2025, representing a year-on-year increase of 41.27% [2] - The semiconductor segment's revenue share increased from 46% in 2024 to 57% in 2025, indicating a growing contribution to overall profitability [2] - The company identifies key opportunities in the semiconductor materials industry driven by AI, supply chain stability demands, and emerging fields such as large silicon wafers and advanced packaging [2] Group 3 - The CMP polishing pad business achieved sales revenue of 795 million yuan in the first three quarters of 2025, a year-on-year increase of 52% [3] - In the third quarter alone, the CMP polishing pad sales reached 320 million yuan, marking a 42% year-on-year growth and setting a new record for quarterly revenue [3] - The company is actively engaging with foreign and overseas market clients to promote its CMP polishing pad products, leveraging supply chain stability and product competitiveness for better market opportunities [3]