JCET(SH:600584) Zheng Quan Ri Bao·2026-01-14 15:43Group 1 - The global memory market is entering a "super cycle," with price increases spreading to downstream packaging and testing segments due to rising demand for advanced packaging, increased raw material costs, and tight capacity [1] - Major companies in the memory packaging and testing sector are operating at full capacity, with Taiwanese firms raising prices and A-share listed companies reporting full production status [1] - Companies like Shenzhen Changcheng Development Technology Co., Ltd. and Jiangsu Changdian Technology Co., Ltd. are experiencing significant growth in their memory-related packaging and testing businesses, with revenue in related sectors increasing by nearly 70% year-on-year [1] Group 2 - As traditional chip processes face physical limits, advanced packaging and testing technologies are becoming crucial for enhancing chip performance, prompting A-share listed companies to actively invest in these technologies [2] - Jiangsu Changdian Technology Co., Ltd. plans to increase R&D investment in advanced packaging technologies to align with the growing demand [2] - Shenzhen Baiwei Storage Technology Co., Ltd. offers integrated solutions for storage and wafer-level advanced packaging, aiming to create significant value in the AI era [2] Group 3 - Chinese companies in the memory packaging and testing sector are enhancing their competitiveness through R&D innovation and capacity expansion, with expectations of increasing market share in the future [3]