SRAM 在 AI 推理中拓展应用，堆叠方案可 助力容量扩充 核心观点 投资建议与投资标的 ⚫ SRAM 在 AI 推理中拓展应用，堆叠方案助力容量扩充。相关标的：布局定制化存储 方案的国内头部存储芯片设计厂商兆易创新、北京君正等；布局基于 SRAM 的数字 存算一体方案的恒烁股份；布局先进封装的长电科技、通富微电等；布局混合键合 设备的拓荆科技、华海清科、百傲化学、芯源微等；有望受益于英伟达新芯片方案 的头部 PCB 厂商深南电路、沪电股份、胜宏科技等；PCB 上游企业生益科技、南 亚新材、宏和科技、菲利华、中材科技等。 电子行业 行业研究 | 动态跟踪 国家/地区 中国 行业 电子行业 报告发布日期 2026 年 03 月 07 日 看好（维持） | 薛宏伟 | 执业证书编号：S0860524110001 | | --- | --- | | | xuehongwei@orientsec.com.cn | | | 021-63326320 | | 蒯剑 | 执业证书编号：S0860514050005 | | | 香港证监会牌照：BPT856 | | | kuaijian@orientsec.com.cn | ...

证券代码：600584 证券简称：长电科技 公告编号：临 2026-004 江苏长电科技股份有限公司 参与设立投资基金暨对外投资的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 投资标的名称：交融芯智（上海）私募投资基金合伙企业（有限合伙） 3、统一社会信用代码：91310115MAK78ULL0T 投资金额：基金规模人民币 13.46 亿元，公司全资子公司云鲛龙作为有 限合伙人拟认缴出资人民币 4.038 亿元 特别风险提示：该投资基金已完成工商注册登记，尚需完成中国证券投 资基金业协会备案手续后，方可从事相关投资活动，在备案实施过程中尚存在不 确定性。 股权投资基金具有投资周期长、流动性低的特点，公司本次投资可能面临投 资回收期较长的风险。基金在运营过程中受所投企业的管理和运营、经济周期和 政策的变化以及市场竞争格局的变化等多重因素影响，可能出现无法达到预期投 资收益或本金损失等风险。 一、对外投资概述 2025 年 12 月 30 日，公司第九届董事会第一次会议审议通过了《关于拟参 股设立专项股 ...

近日，交融芯智（上海）私募投资基金合伙企业（有限合伙）正式登记成立，出资额13.46亿元。 经营范围包含：以私募基金从事股权投资、投资管理、资产管理等活动等。企查查股权穿透显示， 该合伙企业由工银金融资产投资有限公司、交银金融资产投资有限公司、长电科技旗下上海云鲛龙 企业管理有限公司等共同持股。 来源：企查查 | 每日｜荐读 | | --- | | 榜单： 「2026产业投资100强」评选开启 | | 荐读： 告别"DPI焦虑"，一家GP的"多赢"解题思路 | | 荐读： 2025年IPO退出盘点：哪些GP赚钱了？ | | 热文： 投资人"忙疯了" | ...

Core Viewpoint - The CPO concept stocks in the A-share market experienced a collective decline, with significant drops in several key stocks on February 27, indicating a bearish trend in this sector [1]. Group 1: Stock Performance - Xinyisheng (新易盛) fell by 7.02%, with a total market capitalization of 35.67 billion and a year-to-date decline of 16.72% [2]. - Zhongji Xuchuang (中际旭创) decreased by 6.40%, having a market cap of 59.51 billion and a year-to-date drop of 12.20% [2]. - Taichengguang (太辰光) saw a decline of 6.34%, with a market value of 30.6 billion and a year-to-date increase of 16.48% [2]. - Changxin Bochuang (长芯博创) dropped by 6.16%, with a market cap of 43 billion and a year-to-date increase of 3.74% [2]. - Zhili Fang (智立方) decreased by 5.54%, with a market capitalization of 10.1 billion and a year-to-date increase of 67.18% [2]. - Dekeli (德科立) fell by 5.41%, with a market cap of 25.5 billion and a year-to-date increase of 16.96% [2]. - Shijia Guangzi (仕佳光子) declined by 4.88%, with a market value of 37.8 billion and a year-to-date drop of 5.77% [2]. - Cambridge Technology (剑桥科技) decreased by 4.86%, with a market cap of 36.3 billion and a year-to-date drop of 23.31% [2]. - Guangku Technology (光库科技) fell by 4.38%, with a market value of 40.6 billion and a year-to-date increase of 10.83% [2]. - Jingwang Electronics (景旺电子) saw a decline of 4.28%, with a market cap of 65.3 billion and a year-to-date drop of 9.34% [2]. - Robot Technology (罗博特) decreased by 4.19%, with a market value of 63.7 billion and a year-to-date increase of 62.91% [2]. - Liante Technology (联特科技) fell by 3.64%, with a market cap of 23.8 billion and a year-to-date increase of 8.70% [2]. - Huilv Ecology (汇绿生态) decreased by 3.03%, with a market value of 23.4 billion and a year-to-date increase of 36.03% [2]. - Juguang Technology (炬光科技) fell by 3.01%, with a market cap of 33.2 billion and a year-to-date increase of 111.22% [2]. - Tiantong Co. (天通股份) decreased by 2.96%, with a market value of 21 billion and a year-to-date increase of 29.78% [2]. - Tianfu Communication (天孚通信) fell by 2.53%, with a market cap of 274.3 billion and a year-to-date increase of 73.80% [2]. - Changjia Technology (长甲科技) decreased by 2.32%, with a market value of 85.2 billion and a year-to-date increase of 29.39% [2].

Group 1 - The chip ETF Guangfa (159801) opened down 1.22% at 0.968 yuan on February 27 [1] - Major holdings in the chip ETF Guangfa include companies such as SMIC, Haiguang Information, and Cambrian, all of which experienced declines in their stock prices [1] - The performance benchmark for the chip ETF Guangfa is the return rate of the National Securities Semiconductor Chip Index, managed by Guangfa Fund Management Co., Ltd. [1] Group 2 - Since its establishment on January 20, 2020, the chip ETF Guangfa has achieved a return of 95.92%, while its return over the past month has been -1.15% [1]

Summary of Key Points from the Conference Call Industry and Company Involved - The discussion revolves around the supply chain for NVIDIA's LPU (Large Processing Unit) and its associated components, highlighting various suppliers and manufacturers involved in the production process [1]. Core Insights and Arguments - **Foundry**: TSMC is identified as the primary foundry for the LPU, utilizing N3 and N5 process technologies [1]. - **SRAM Suppliers**: The SRAM suppliers include Powerchip, Winbond, Etron, and Aip, all of which are Taiwanese companies. The LPU leverages on-chip SRAM to bypass the bottlenecks associated with HBM (High Bandwidth Memory) and CoWoS (Chip-on-Wafer-on-Substrate), thus reducing reliance on the three major HBM suppliers: Samsung, SK Hynix, and Micron [1]. - **PCB Suppliers**: The PCB (Printed Circuit Board) suppliers mentioned are Shenghong Technology and Unimicron [1]. - **Resin Supplier**: Dongcai Technology is noted as the resin supplier for the LPU [1]. - **Q Fabric**: The Q fabric supplier is identified as Fihua [1]. - **CCL (Copper Clad Laminate) Suppliers**: The main suppliers for CCL are Taiguang (primary supplier) and Shengyi Technology [1]. - **Testing and Packaging**: ASE (Advanced Semiconductor Engineering) is the main supplier for testing and packaging, along with Tongfu Microelectronics and Changdian Technology. The LPU does not require complex CoWoS advanced packaging and primarily uses traditional packaging methods [1]. - **System Integration**: The system integration for servers and cabinets is handled by companies such as Foxconn Industrial Internet, Quanta, and Wistron [1]. Other Important but Potentially Overlooked Content - The strategic choice to utilize on-chip SRAM is significant as it allows NVIDIA to mitigate risks associated with supply chain dependencies on HBM suppliers, which could be crucial in maintaining production efficiency and cost-effectiveness [1]. - The mention of traditional packaging methods indicates a potential shift in manufacturing strategies that could impact the overall cost structure and production timelines for NVIDIA's LPU [1].

数据显示，华泰柏瑞基金旗下1只基金位居长电科技十大流通股东。华泰柏瑞沪深300ETF（510300）三 季度减持106.97万股，持有股数2450.11万股，占流通股的比例为1.37%。根据测算，今日浮盈赚取约 5855.76万元。 华泰柏瑞沪深300ETF（510300）成立日期2012年5月4日，最新规模4222.58亿。今年以来收益2.44%， 同类排名4224/5572；近一年收益23.84%，同类排名2653/4311；成立以来收益121.46%。 华泰柏瑞沪深300ETF（510300）基金经理为柳军。 2月26日，长电科技涨5.09%，截至发稿，报49.31元/股，成交29.49亿元，换手率3.46%，总市值882.36 亿元。 资料显示，江苏长电科技股份有限公司位于江苏省江阴市滨江中路275号，成立日期1998年11月6日，上 市日期2003年6月3日，公司主营业务涉及集成电路的系统集成、设计仿真、技术开发、产品认证、晶圆 中测、晶圆级中道封装测试、系统级封装测试、芯片成品测试并可向世界各地的半导体客户提供直运服 务。主营业务收入构成为：芯片封测99.59%，其他0.35%，租赁收入0.05% ...

半导体龙头ETF工银（159665）业绩比较基准为国证半导体芯片指数收益率，管理人为工银瑞信基金管 理有限公司，基金经理为史宝珖，成立（2022-12-22）以来回报为102.61%，近一个月回报为-4.20%。 来源：新浪基金∞工作室 2月26日，半导体龙头ETF工银（159665）开盘涨0.10%，报2.026元。半导体龙头ETF工银（159665）重 仓股方面，中芯国际开盘涨0.00%，海光信息涨2.00%，寒武纪涨1.15%，北方华创涨0.00%，兆易创新 涨1.50%，中微公司跌0.43%，澜起科技涨0.10%，豪威集团涨0.22%，拓荆科技涨0.16%，长电科技跌 0.04%。 声明：市场有风险，投资需谨慎。本文基于第三方数据库自动发布，不代表新浪财经观点，任何在本文 出现的信息均只作为参考，不构成个人投资建议。如有出入请以实际公告为准。如有疑问，请联系 biz@staff.sina.com.cn。 ...

Core Viewpoint - Changdian Technology (Jiangyin) Co., Ltd. has significantly increased its registered capital from 10 million RMB to 2.5 billion RMB, marking a 24,900% increase, which has attracted market attention [1] Group 1: Company Overview - The company was established in May 2025 and is less than a year old, with Li Quanbing as the legal representative [1] - It operates in the fields of power electronic components manufacturing, integrated circuit manufacturing and sales, and integrated circuit chip and product manufacturing and sales [1] - The company is wholly owned by Jiangsu Changdian Technology Co., Ltd. (600584), which is listed on the A-share market [1] Group 2: Capital Increase Implications - The increase in registered capital from 10 million to 2.5 billion RMB indicates a 249-fold expansion, suggesting a strategic move rather than a routine operational adjustment [1] - As the third-largest packaging and testing company globally and the largest in China, Changdian Technology's capital actions are closely monitored within the industry [1] - The timing of this capital injection coincides with a recovery in the semiconductor industry and accelerated advancements in packaging technology, signaling confidence in the long-term prospects of the packaging and testing business [1]

Group 1 - The Integrated Circuit ETF (159546) opened with a gain of 0.29%, priced at 2.063 yuan [1] - Major holdings in the ETF include: Cambrian (up 0.79%), SMIC (up 1.02%), Haiguang Information (up 0.75%), and others with varying performance [1] - The ETF's performance benchmark is the CSI All-Share Integrated Circuit Index return, managed by Guotai Fund Management Co., Ltd., with a return of 105.49% since its establishment on October 11, 2023, and a one-month return of -4.74% [1]