宏达电子拟10亿元投建 晶圆制造封测基地

Group 1 - The core point of the news is that Hongda Electronics (300726) announced an investment by its subsidiary, Siwei Technology, to establish a semiconductor special device chip research, design, production, and testing business in Wuxi High-tech Development Zone, with a total planned investment of 1 billion yuan [1][2] - The project will be implemented in two phases: Phase 1 from 2026 to 2028 with an estimated investment of 300 million yuan, and Phase 2 will depend on the actual investment of Phase 1 and future market conditions, with a total investment of 700 million yuan [1][2] - The investment aims to meet the demand for high-quality semiconductor products in sectors such as new energy, consumer electronics, and industrial control, supporting the independent and controllable development of the domestic semiconductor industry [2] Group 2 - The investment does not involve related party transactions and does not constitute a major asset reorganization, thus does not require shareholder approval [2] - The project is expected to enhance the company's product matrix and create new revenue growth opportunities by focusing on high-reliability semiconductor device packaging lines and chip production lines [2] - The Wuxi National High-tech Industrial Development Zone Management Committee will provide development support policies to ensure the project's success in the region [2]

Hongda Electronics-宏达电子拟10亿元投建 晶圆制造封测基地 - Reportify