加速创新材料业务海外市场拓展 鼎龙股份拟发行H股赴港上市

Core Viewpoint - Dinglong Co., Ltd. is planning to issue H-shares and list on the Hong Kong Stock Exchange to accelerate the expansion of its innovative materials business overseas, aiming to enhance its global competitiveness and operational performance [1][2] Group 1: Company Strategy - The company aims to leverage its strengthened capabilities in innovative materials and successful domestic market expansion to focus on overseas market development as a key growth direction [1] - The issuance of H-shares is part of a broader strategy to deepen the company's global layout in the innovative materials sector, enhance international brand influence, and improve comprehensive competitiveness [1][2] Group 2: Market Position - Dinglong Co., Ltd. is recognized as a leading platform company in the critical innovation materials sector in China, with a range of innovative materials products deeply penetrating the domestic market [2] - The company is a market leader in supplying CMP polishing pads for integrated circuit manufacturing and has established a strong presence in CMP polishing liquids and cleaning agents [2] - In the flexible display materials sector, Dinglong holds a leading position in the domestic market for YPI and PSPI, and is actively involved in the semiconductor KrF/ArF wafer photoresist and advanced packaging materials business [2]