序轮科技获超亿元产业资本加持，加速半导体材料国产化

Core Viewpoint - Beijing Xulun Technology Co., Ltd. has completed a new round of strategic financing exceeding 100 million yuan, aimed at expanding production capacity and enhancing R&D in semiconductor packaging materials [1][3]. Group 1: Financing and Investment - The A4 round of financing was led by Northern Huachuang's strategic investment fund, while the A3 round was co-led by Beijing Electric Control Investment Fund and Qianhai Ark Fund [1]. - The funds will be used for the second phase of expansion for UV Tape/DAF product lines and to strengthen R&D in semiconductor packaging materials [3]. Group 2: Strategic Partnerships - Northern Huachuang's involvement will provide strong support for process equipment collaboration and process validation for Xulun Technology [3]. - Beijing Electric Control, as a major stakeholder in BOE and Yandong Microelectronics, will open its industrial ecosystem to Xulun Technology, accelerating product validation and integration in core processing scenarios [3]. Group 3: Technical Expertise and Infrastructure - The core technical team of Xulun Technology consists of members from top domestic and international universities and research institutions, specializing in materials science and chemical engineering [5]. - The company has established a 5,000 square meter R&D center in Beijing and a professional coating pilot base in Hebei, along with precision coating manufacturing lines in Jiangsu [5]. Group 4: Product Offerings and Market Position - Xulun Technology's products cover critical processes such as wafer thinning, cutting, chip mounting, and packaging, widely used in high-end manufacturing fields like RF chips and HBM [5][6]. - The company has provided mass production support to numerous leading domestic semiconductor firms, becoming a key player in the localization of semiconductor materials [6].