USC(SH:688403) Xin Lang Cai Jing·2026-01-15 10:17Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, benefiting from the growing demand driven by AI infrastructure. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd., and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging businesses [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2][3]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, a year-on-year increase of 21.05%, and a net profit of 124 million yuan, up 23.21% year-on-year [9]. Group 2: Financial Performance - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. - As of September 30, 2025, the number of shareholders increased by 15.93%, with an average of 36,445 shares held per shareholder, reflecting growing investor interest [9]. Group 3: Market Position and Industry Context - Hefei Xinhui Microelectronics specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3][8]. - The company operates within the semiconductor industry, specifically in the electronic sector, focusing on advanced packaging, OLED, and other related concepts [8].