德龙激光(688170.SH)：晶圆激光隐切设备已取得突破性订单

Group 1 - The company, Delong Laser (688170.SH), has developed wafer laser cutting equipment (SDBG), wafer laser grooving equipment, and laser marking equipment targeting the storage chip sector [1] - The wafer laser cutting equipment (SDBG) has secured a breakthrough order, while other products are currently in the validation stage [1] - The order amounts in this field are relatively small at present [1]