Core Viewpoint - Kingdao Technology (301279.SZ) has announced a plan to issue convertible bonds to raise up to RMB 305.72 million, with the net proceeds to be invested in various projects including the construction of high-power transmission assemblies and a digital transformation and R&D innovation center [1][3]. Group 1: Fundraising Details - The total amount to be raised from the convertible bond issuance is RMB 305.72 million, which will be allocated to three main projects: 1. High-power transmission assembly and intelligent logistics robot reducer unit construction project: RMB 202.54 million 2. Digital transformation and R&D innovation center construction project: RMB 68.19 million 3. Working capital supplementation project: RMB 35 million [1][3]. - The convertible bonds will be issued at a par value of RMB 100 each and will have a term of six years from the date of issuance [2][3]. Group 2: Issuance and Subscription - The issuance of the convertible bonds will be authorized by the company's shareholders, and the specific issuance method will be determined in consultation with the underwriters [4]. - Existing shareholders will have priority in subscribing to the convertible bonds, with the specific allocation ratio to be determined based on market conditions [4]. Group 3: Previous Fundraising and Financial Performance - In a previous fundraising round, Kingdao Technology raised RMB 780 million, with a net amount of RMB 706 million after deducting issuance costs, exceeding the original plan by RMB 256 million [5]. - The company plans to distribute dividends in 2024, proposing a cash dividend of RMB 2.60 per 10 shares and a capital reserve increase of 3 shares for every 10 shares held [5].
金道科技股价高位拟发可转债 2022年上市超募2.6亿元