联电：盘前涨5.7%，拟7亿新台币增资欣兴合作布局AI

Core Viewpoint - The collaboration between Unimicron Technology and United Microelectronics Corporation (UMC) aims to enhance the semiconductor advanced packaging supply chain in response to high-end manufacturing demands in the AI era [1] Group 1: Partnership Details - UMC plans to invest NT$700 million in Unimicron's cash capital increase [1] - Unimicron intends to issue unsecured corporate bonds not exceeding NT$15 billion [1] Group 2: Strategic Implications - The partnership focuses on addressing the capacity bottleneck of TSMC's CoWoS technology [1] - Integrating Unimicron into UMC's advanced packaging core industry chain strengthens ecosystem integration [1]