深圳首单市属国企创投机构银行间市场科创债发行

Group 1 - The core point of the article is the issuance of the first phase of technology innovation corporate bonds by Shenzhen High-tech Investment Venture Capital Co., Ltd., with a registered amount of 1 billion yuan and an initial issuance scale of 200 million yuan, marking a new low in the interest rate for technology innovation bonds in the country this year [1] - The bond has a term of 3 years and a coupon rate of 1.8%, with a subscription multiple of 3.2 times, indicating strong market interest [1] - This issuance is a significant breakthrough for Shenzhen High-tech Investment in utilizing market-oriented financial tools to support technological innovation, contributing to the construction of Shenzhen's financial ecosystem for technology innovation [1] Group 2 - The funds raised will be directed towards strategic emerging industries such as new-generation electronic information, high-end equipment manufacturing, biomedicine and health, and green low-carbon sectors, as well as core areas like aerospace, military industry, semiconductors, and artificial intelligence [1] - This initiative reflects the determination of state-owned capital to root itself in technological innovation and serve the real economy, while also providing a model for similar institutions to broaden financing channels and optimize capital structures [1] - Shenzhen High-tech Investment aims to leverage this bond issuance as an opportunity to play the role of "patient capital" in leading the construction of a globally influential industrial technology innovation center in Shenzhen [2]