Xuan Gu Bao·2026-01-20 23:20Group 1 - TSMC is increasing its WMCM (Wafer-Level Multi-Chip Module) packaging capacity to meet the demand for Apple's A20 series chips, with a projected monthly capacity of 60,000 wafers by the end of 2026 and a potential doubling to over 120,000 wafers by 2027 [1] - The shift towards WMCM packaging will directly impact the semiconductor supply chain, with TSMC and strategic partners handling the backend wafer-level testing (CP) and final testing (FT) [1] - Apple will be adopting WMCM packaging for the first time in its iPhone processors, allowing for direct integration of different components like SoC and DRAM at the wafer level, enhancing thermal and signal integrity [1] Group 2 - The advanced packaging sector is experiencing full capacity, with expectations of price increases due to strong overseas demand and domestic market growth, particularly in 2026 when domestic advanced processes are expected to release significant capacity [2] - Companies like Chipbond Technology are gaining recognition for their advanced packaging equipment, which is being utilized by leading domestic packaging firms, with equipment prices in the million-level range [2] - Huatian Technology has mastered various advanced packaging technologies and is actively expanding its advanced packaging business scale through ongoing R&D and production efforts [2]