Ge Long Hui·2026-01-21 01:11Core Viewpoint - The global 8-inch wafer supply and demand is entering a period of imbalance, primarily due to strategic capacity reductions by TSMC and Samsung, leading to a projected 2.4% shrinkage in global 8-inch foundry capacity by 2026 [1] Group 1: Industry Overview - The demand for AI-driven power management chips (Power IC) remains strong, pushing the average industry capacity utilization rate back up to a high of 90% [1] - Chinese mainland wafer foundries are emerging as alternative solutions to meet the demand for 8-inch chips, with price increases expected between 5% and 20% [1] Group 2: Company-Specific Insights - TSMC currently operates four 8-inch wafer fabs and one 6-inch fab in Taiwan, with a monthly production capacity of approximately 528,000 wafers. A complete exit from the 8-inch market by 2027 would require continued capacity reductions starting in 2026 [1] - Samsung Electronics plans to reduce 8-inch wafer production starting in the second half of 2025, reallocating resources to compete in the 12-inch wafer market. Samsung's monthly production capacity for 8-inch wafers is also around 528,000 wafers [1] - United Microelectronics Corporation (UMC) has an 8-inch wafer monthly production capacity that previously exceeded 360,000 wafers, with a current utilization rate of about 70%. UMC is optimistic about continued growth in operations through 2026 by focusing on specialized process technologies [1] - Semiconductor Manufacturing International Corporation (SMIC) operates three 8-inch fabs and four 12-inch fabs, with a historical monthly production capacity of 1,023,000 wafers (equivalent to 8-inch) as of Q3 2025, achieving a capacity utilization rate of 95.8%, the highest since Q2 2022 [1] - Hua Hong Semiconductor demonstrates competitive strength in specialty processes, with some 8-inch production lines nearing 100% utilization, benefiting from orders transferred from international power semiconductor giants [1]