Liande(SZ:300545) Ge Long Hui·2026-01-21 01:21Core Viewpoint - The company is focusing on the semiconductor industry, particularly in the field of chip packaging and testing equipment, and is committed to expanding its presence in advanced packaging processes and third-generation semiconductor equipment [1] Group 1: Company Focus - The company's current equipment in the semiconductor sector mainly includes high-speed and high-precision devices such as display driver chip ILB flip chip machines, semiconductor flip chip machines, soft solder die bonding machines, eutectic die bonding machines, film laminating machines, and lead frame inspection machines [1] - The company plans to continuously increase its R&D investment in the semiconductor sector to enhance its new business segment and promote the development of its semiconductor equipment business [1] Group 2: Market and Technology Expansion - The company is actively laying out and expanding in the areas of advanced packaging processes and third-generation semiconductor-related equipment, focusing on both market and technological aspects [1]