TSMC(US:TSM) Jin Rong Jie·2026-01-22 01:10Group 1 - TSMC plans to increase investment in advanced packaging technology, upgrading existing InFO equipment at the Longtan AP3 factory and building a new WMCM production line at the Chiayi AP7 factory [1] - By the end of 2026, TSMC's WMCM capacity is expected to reach approximately 60,000 wafers per month, with a potential doubling to 120,000 wafers per month by 2027 [1] - TSMC's capital expenditure guidance for 2026 is set at $52-56 billion, with 10-20% allocated to advanced packaging, testing, and mask manufacturing, a significant increase from the previous 10% [1] Group 2 - The new WMCM technology is aimed at high-end AI chips and is seen as a core path to enhance chip integration and performance, addressing the current bottleneck in advanced packaging capacity [1] - The global advanced packaging market is projected to grow from approximately $46 billion in 2024 to about $80 billion by 2030 [2] - The transition to WMCM packaging for Apple's A20 series chip is a direct catalyst for TSMC's new WMCM capacity, highlighting the increasing importance of packaging in semiconductor performance [2]