Suntak(SZ:002815) Xin Lang Cai Jing·2026-01-22 08:50Core Viewpoint - The company announced an investment agreement for a new project in Jiangsu, aiming to enhance its capabilities in functional IC packaging [1] Group 1: Project Details - The project, named "End-side Functional IC Packaging Substrate Project," will be located in Qindeng Town, Kunshan City, Jiangsu [1] - The total investment for the project is set at 1 billion yuan, funded through self-owned and self-raised capital [1] - The project is scheduled for land listing in May 2026, construction to begin in September 2026, and expected to be completed and put into production by September 2028 [1] Group 2: Approval and Risks - The investment does not constitute a related party transaction or a major asset restructuring [1] - The project faces potential risks related to approval, implementation, market conditions, and funding [1]