1、本次担保基本情况 崇达技术股份有限公司（以下简称"公司"）因子公司珠海崇达电路技术有 限公司（以下简称"珠海崇达"）、大连崇达电子有限公司（以下简称"大连电 子"）日常生产经营需要，于近日分别与中国民生银行股份有限公司深圳分行（以 下简称"民生银行深圳分行"）、中国工商银行股份有限公司大连长兴岛支行（以 下简称"工行大连长兴岛支行"）签署了担保合同，为子公司与银行发生的授信 业务提供信用保证。 证券代码：002815 证券简称：崇达技术 公告编号：2026-016 崇达技术股份有限公司 关于为子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、公司担保事项概述 民生银行深圳分行为珠海崇达提供综合授信额度 1 亿元，公司为全资子公司 本次授信业务提供全额信用担保；大连长兴岛支行为大连电子提供综合授信额度 1,000 万元，公司为子公司本次授信业务提供全额信用担保，同时，大连电子的 其他股东孙利刚就本次担保事项为公司提供反担保，公司已与孙利刚签署反担保 合同。 2、公司本次担保额度的审议情况 2025 年 4 月 15 日，公司召开的 ...

本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记 载、误导性陈述或重大遗漏。 崇达技术股份有限公司（以下简称"公司"）控股子公司江苏普诺威电子股份 有限公司（以下简称"普诺威"）于 2026 年 3 月 13 日收到全国中小企业股份转让 系统有限责任公司出具的《关于同意江苏普诺威电子股份有限公司股票在全国中小 企业股份转让系统挂牌的函》（股转函〔2026〕386 号），同意普诺威股票在全国中 小企业股份转让系统（以下简称"新三板"）挂牌公开转让，交易方式为集合竞价 交易。普诺威申请挂牌时股东人数未超过 200 人，按规定中国证监会豁免核准普诺 威股票公开转让，普诺威挂牌后纳入非上市公众公司监管。 普诺威本次在新三板挂牌，有利于其拓展融资渠道，增强市场竞争能力，提升 其资产运营效率和价值，增加资产流动性，并有效提高公司持有资产的价值，符合 公司长远利益。 证券代码：002815 证券简称：崇达技术 公告编号：2026-015 崇达技术股份有限公司 关于控股子公司收到全国中小企业股份转让系统同意挂牌函的公 告 后续普诺威将按照有关规定办理股票挂牌手续，公司会根据进展情况及时履行 信息披露义务。 ...

证券代码：002815 证券简称：崇达技术 公告编号：2026-014 崇达技术股份有限公司 关于为子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 招商银行深圳分行分别为深圳崇达、江门崇达、珠海崇达提供综合授信额度 各 1 亿元，公司为这三家全资子公司本次授信业务提供全额信用担保。 2、公司本次担保额度的审议情况 2025 年 4 月 15 日，公司召开的第五届董事会第二十二次会议、第五届监事 会第十五次会议，以及 2025 年 5 月 9 日召开的 2024 年度股东会，审议通过了《关 于公司 2025 年度对子公司担保额度预计的议案》，同意公司分别为深圳崇达、 江门崇达、珠海崇达提供不超过 147,000 万元、130,000 万元、175,000 万元担保 额度，该担保额度使用有效期为股东会审议通过之日起十二个月内。 2025 年 12 月 26 日，公司在 2024 年度股东会审议通过的担保总额度不变的 情况下，在珠海崇达、江门崇达之间调剂担保额度，调剂后江门崇达、珠海崇达 的担保额度分别为 120,000 万元，185,00 ...

证券代码：002815 证券简称：崇达技术 公告编号：2026-013 崇达技术股份有限公司 公司实际控制人姜雪飞先生、朱雪花女士及一致行动人姜曙光先生未参与本 次限制性股票激励计划，持股数量未发生变化。本次权益变动后，公司控股股东、 实际控制人及其一致行动人合计持股比例由 47.1949%被动稀释至 46.5675%，触 及 1%刻度。现将有关情况公告如下： 1 | 1．基本情况 | | | | | --- | --- | --- | --- | | 信息披露义务人 | 姜雪飞、朱雪花、姜曙光 | | | | 住所 | 广东省深圳市福田区******、辽宁省大连市沙河口区****** | | | | 权益变动时间 2026 年 | 2 月 27 日 | | | | 2026 | 年 月 2 | 日，公司完成了 27 | 年限制性股票激励计划 2026 | | | 首次授予股份的授予登记工作，授予登记完成后公司总股本由 | | | | 1,217,745,524 | | 股增加至 1,234,151,324 | 股。 | | 权益变动过程 | | 信披义务人未参与本次限制性股票激励计划，持股数量未发 | | ...

Group 1 - The company has made progress in the CPO (Chip-on-Board) application field by delivering relevant PCB products based on customer demand [2]

Group 1 - Mingyang Circuit focuses on the R&D, production, and sales of printed circuit boards (PCBs), covering high multilayer boards, HDI boards, and rigid-flex boards, widely used in industrial control, communication equipment, and automotive electronics. The demand for high-reliability, high-density PCBs is continuously growing due to industrial automation upgrades, 5G communication network construction, and the increasing penetration of new energy vehicles [1][32] - Weirgao specializes in the R&D, production, and sales of electronic-grade special epoxy resins and related composite materials, which are key raw materials for PCBs. The demand for high-frequency, high-temperature, and low-loss materials is increasing in 5G communication, data centers, and new energy vehicles, leading to an expanding market space for specialty epoxy resins [2][33] - Qiangda Circuit focuses on the R&D, production, and sales of high-density interconnect printed circuit boards (HDI), widely used in consumer electronics such as smartphones and tablets. The market demand for high-end products like high multilayer HDI and AnyLayer HDI is continuously growing due to the recovery of the consumer electronics market and the upgrade of smart terminal functions [3][34] Group 2 - Benchuan Intelligent specializes in the R&D, production, and sales of PCBs, with core products including communication boards, automotive boards, and industrial control boards. The market demand for high-reliability, high-frequency PCBs is expanding due to the construction of 5G base stations and the upgrade of new energy vehicle systems [4][35] - Kexiang Co., Ltd. focuses on the R&D, production, and sales of HDI and high multilayer boards, covering various fields including consumer electronics and automotive electronics. The demand for high-end PCBs is continuously growing due to the functional upgrades of consumer electronics and the increasing demand for automotive electronic systems [5][36] - Jinlu Electronics specializes in the R&D, production, and sales of PCBs, with core products including automotive electronic boards and communication boards. The demand for high-reliability, high-integration PCBs is continuously growing due to the increasing penetration of new energy vehicles and the deep coverage of 5G networks [6][37] Group 3 - Shengyi Technology is a leading global supplier of copper-clad laminates (CCL) and related electronic materials, with products widely used in PCBs and electronic packaging. The demand for high-end copper-clad laminates is continuously expanding due to the increasing demand for high-frequency, high-temperature materials in 5G communication and data centers [7][38] - Xiehe Electronics focuses on the R&D, production, and sales of PCBs, including high-frequency and high-speed boards. The market demand for high-end products is continuously growing due to the advancement of 5G networks and the expansion of new energy vehicle systems [8][39] - Shiyun Circuit specializes in the R&D, production, and sales of PCBs, covering automotive electronics, consumer electronics, and industrial control. The demand for high-reliability, high-integration automotive PCBs is continuously growing due to the increasing complexity of in-vehicle electronic systems [9][40]

证券代码：002815 证券简称：崇达技术 公告编号：2026-012 崇达技术股份有限公司 关于 2026 年限制性股票激励计划首次授予登记完成的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 根据《上市公司股权激励管理办法》、《深圳证券交易所上市公司自律监管 指南第1号——业务办理》以及中国证券登记结算有限责任公司深圳分公司的相 关规定，崇达技术股份有限公司（以下简称"公司"）完成了2026年限制性股票 激励计划首次授予股份的授予登记工作，具体情况公告如下： 一、已履行的相关审批程序 1、2026 年 1 月 12 日，公司召开第六届董事会第二次会议，审议通过了《关 于<崇达技术股份有限公司 2026 年限制性股票激励计划（草案）>及其摘要的议 案》等议案，作为本激励计划激励对象的关联董事已回避表决。公司董事会薪酬 与考核委员会就本次激励计划是否有利于公司的持续发展及是否存在明显损害 公司及全体股东利益的情形发表了意见。 2、2026 年 1 月 13 日至 2026 年 1 月 22 日期间，公司对授予的激励对象的 姓名和职务在公司内部 ...

Core Viewpoint - Chongda Technology (002815) is accelerating the capacity release of its Zhuhai plants and maintaining a good overall capacity utilization rate [1] Group 1: Production Capacity - The company is speeding up the capacity release of its Zhuhai Plant 1 and Plant 2, indicating a positive operational trend [1] - Zhuhai Plant 3 has not yet commenced operations, and the company will make decisions regarding its launch based on overall strategic planning and market demand [1] Group 2: International Expansion - The construction of the Thailand factory is progressing rapidly to serve international customers in North America and other regions, with operations to follow the planned schedule [1]

Company Project Advancement - The company plans to invest 1 billion yuan to establish a production base for integrated circuit packaging substrates for end-side chips through its subsidiary, Jiangsu Punowei Electronics Co., Ltd. The project is scheduled for land listing in May 2026, construction to begin in September 2026, and is expected to be completed and put into production by September 2028, aiming to expand the company's capacity in the high-end IC substrate sector [2]. Executive Share Reduction - The company's Vice General Manager, Jiang Shuguang, plans to reduce his holdings by no more than 2 million shares, which accounts for no more than 0.1642% of the company's total share capital, between January 16, 2026, and April 15, 2026. This decision is based on personal financial needs, with the shares originating from the company's pre-IPO holdings [3].

Group 1 - The core point of the article is that Chongda Technology reported its number of shareholders as of February 10, 2026, which stands at 97,045 households [2]