崇达技术(002815.SZ)：子公司拟投资建设“端侧功能性IC封装载板项目”

Core Viewpoint - Chongda Technology (002815.SZ) aims to enhance its core competitiveness in the high-end integrated circuit substrate sector by investing in a new project to capitalize on market opportunities presented by the rapid development of end-side chips [1] Group 1: Investment Agreement - The company convened its sixth board meeting to approve the investment agreement for the end-side functional IC packaging substrate project [1] - The agreement was signed between the company's subsidiary, Jiangsu Punowei Electronics Co., Ltd. (referred to as "Punowei"), and the government of Qian Deng Town, Kunshan City [1] - The total investment for the project is set at RMB 1 billion, funded through Punowei's own and self-raised funds [1]