崇达技术：控股子公司拟10亿元投建端侧功能性IC封装载板项目

Group 1 - The core point of the article is that Chongda Technology (002815) announced an investment agreement for a functional IC packaging substrate project in Kunshan, Jiangsu Province [1] - The total investment for the project is set at 1 billion yuan, which will be funded through the company's own funds and self-raised funds [1] - The project is scheduled to have land bidding in May 2026, commence construction in September 2026, and be completed and put into production by September 2028 [1]