Suntak(SZ:002815) 智通财经网·2026-01-22 11:30Core Viewpoint - The company, Chongda Technology, has signed an investment agreement for a new IC packaging substrate project in Kunshan, Jiangsu, with a total investment of 1 billion yuan [1] Group 1: Project Details - The project will focus on the production of integrated circuit packaging substrates for high-end applications, including end-side chips [1] - The investment will cover the construction of production facilities, R&D facilities, and supporting infrastructure [1] - The project is scheduled to have land available by May 2026, commence construction in September 2026, and be completed by September 2028 [1] Group 2: Strategic Goals - The project aims to expand the company's production capacity and technological advantages in the high-end IC substrate sector [1] - It seeks to optimize the product structure and enhance competitiveness and market share in the critical segments of the semiconductor packaging industry [1]