Core Viewpoint - Tongwei Co., Ltd. has successfully completed the issuance of its first phase of green technology innovation bonds for 2026, with a total issuance amount of 500 million yuan and an interest rate of 2.15% [1] Group 1 - The company has received approval from the trading association to issue debt financing instruments within the validity period [1] - The bonds are named "26 Tongwei GN001 (Science and Technology Innovation Bonds)" with a maturity of 1+1 years, starting from January 22, 2026, to January 22, 2028 [1] - The total planned and actual issuance amount is 500 million yuan, with the funds fully received on January 22 [1] Group 2 - The lead underwriter for the bond issuance is CITIC Bank, with joint lead underwriters being Shanghai Pudong Development Bank and Tianjin Bank [1]
通威股份:完成5亿元2026年度第一期绿色科技创新债券发行