崇达技术斥资10亿元加码IC封装载板 股价涨停

Core Viewpoint - The company Chongda Technology plans to invest 1 billion yuan in a functional IC packaging substrate project in Kunshan, Jiangsu, to enhance its competitiveness in the high-end integrated circuit substrate market, particularly in response to the rapid development of edge-side chips [1] Group 1: Investment and Project Details - The investment project is set to be constructed in Kunshan, with a total investment of 1 billion yuan, funded by the company's own and self-raised funds [1] - The project is scheduled for land listing in May 2026, construction commencement in September 2026, and completion by September 2028 [1] Group 2: Strategic Importance - This investment aligns with the company's strategic planning to capitalize on the AI technology wave and the urgent demand for high-performance, high-density packaging substrates in edge-side devices [1] - The project aims to expand the company's production capacity and technological advantages in the high-end IC substrate sector, optimizing its product structure [1] Group 3: Performance and Growth Targets - For the first three quarters of 2025, the company reported nearly 5.6 billion yuan in revenue, a year-on-year increase of approximately 20%, and a net profit attributable to shareholders of 314 million yuan [2] - The company has set net profit growth targets based on 2025 figures, with minimum growth rates of 10%, 21%, and 34% for 2026, 2027, and 2028 respectively, and target growth rates of 20%, 50%, and 75% [2] - The revenue share from high-end PCB products has increased to over 60%, with successful development of key technologies for AI chips and high-speed communication boards [2]