Group 1 - Resonac, a Japanese semiconductor materials manufacturer, announced a price increase of over 30% for copper foil substrates (CCL) and adhesive films used in printed circuit boards (PCBs) starting March 1 due to tight supply and soaring prices of raw materials like fiberglass cloth [1] - Market rumors suggest that NVIDIA's Rubin Ultra may abandon orthogonal backplanes in favor of copper cable solutions, but industry insiders indicate that the core positioning of orthogonal backplanes remains unchanged [1] - According to Guotai Junan Securities, since the second half of 2025, Jiantao has raised prices three times in August, October, and December, with another increase in December exceeding expectations, indicating a positive pricing cycle across the entire industry chain driven by AI demand [1] Group 2 - Jiantao's stock (01888) has seen an increase of over 5%, with a current price of 13.96 HKD and a trading volume of 81.7041 million HKD [2]
建滔积层板现涨超5% 日本大厂调涨CCL价格三成 市场关注正交背板传闻