德邦科技：芯片底部填充材料等几个品类的先进封装材料2025年已有小批量交付

Core Viewpoint - The company, Debang Technology, indicates that advanced packaging materials such as chip underfill materials, chip frame AD glue, and chip bonding DAF/CDAF films are still in the early stages of development in China, with market share predominantly held by foreign manufacturers from Japan, South Korea, Europe, and the United States [1] Group 1 - The domestic market for advanced packaging materials is currently limited, with few manufacturers capable of validation or introduction [1] - The company is actively investing in research and development to keep pace with the domestic production process and has achieved mass production capabilities [1] - Small batch deliveries of advanced packaging materials are expected by 2025 for several categories, including chip underfill materials, chip frame AD glue, and chip bonding DAF/CDAF films [1] Group 2 - The company anticipates an acceleration in the domestic production process and is looking forward to customers actively adopting large-scale usage of these materials [1]