Nvidia(US:NVDA) 智通财经网·2026-01-26 04:13Core Viewpoint - Samsung Electronics plans to start production of its next-generation High Bandwidth Memory (HBM) chips, HBM4, next month, supplying them to Nvidia, aiming to catch up with competitor SK Hynix after previous supply delays impacted earnings and stock prices [1]. Group 1: Samsung Electronics - Samsung has passed qualification tests for HBM4 from Nvidia and AMD and will begin shipments to Nvidia next month [1]. - The Samsung DS division has decided to start wafer production of 12-layer stacked HBM4 for Nvidia from February [1]. - If the 12-layer stacked HBM4 passes certification without design modifications, Samsung expects to complete process optimization in about three months, with mass production conditions potentially being met by mid-May [1]. Group 2: SK Hynix - SK Hynix plans to begin deploying silicon wafers for HBM chip production at its new M15X factory in Cheongju, South Korea, next month, although it has not specified if HBM4 will be part of the initial production [2]. - SK Hynix announced in October that it had completed negotiations with major customers regarding HBM supply for the following year [1]. Group 3: Market Context - Both Samsung and SK Hynix are set to release their fourth-quarter financial reports on Thursday, where they are expected to share detailed information about HBM4 orders [3]. - Nvidia's CEO Jensen Huang stated that the company is preparing to launch its next-generation chips compatible with HBM4 later this year, with the Vera Rubin platform entering "full production" [3].