飞凯材料：公司将持续聚焦客户前沿需求，推动材料技术的迭代与创新

Core Viewpoint - Feikai Materials (300398) is actively involved in the semiconductor advanced packaging sector, focusing on the production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF and HBM manufacturing processes [1] Group 1: Product Development - The company has achieved stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants for HBF and HBM manufacturing processes [1] - The packaging processes for HBF and HBM involve wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated scaled revenue [1] Group 2: Collaboration and Innovation - The company is closely collaborating with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of HBF and HBM process technologies [1] - Future efforts will continue to focus on customer cutting-edge demands, driving the iteration and innovation of material technologies [1]