飞凯材料：公司始终关注并跟进包括HBF在内的先进封装技术发展趋势

Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, particularly HBF, and is developing materials that can be applied in HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF manufacturing processes [1] - The company is currently in the verification and introduction phase for temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials that are compatible with HBF process conditions [1] - The company is collaborating closely with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of the HBF process [1] Group 2: Future Outlook - The company plans to leverage its existing collaboration foundation to continuously iterate and innovate its material technologies [1] - The goal is to establish a solid technical advantage and enhance market influence in advanced packaging fields such as HBF [1]