Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore

Core Insights - Micron Technology, Inc. has initiated the construction of an advanced wafer fabrication facility in Singapore, representing a planned investment of approximately US $24 billion (SG $31 billion) over 10 years, with wafer output expected to begin in the second half of calendar 2028 to meet growing demand for NAND technology driven by AI and data-centric applications [1] Group 1: Facility and Investment - The new facility will provide 700,000 square feet of cleanroom space and is Singapore's first double-story wafer manufacturing fab [2][1] - This investment will create around 1,600 jobs, contributing to a total of approximately 3,000 new jobs when combined with the previously announced HBM advanced packaging facility [5] Group 2: Strategic Importance - The facility will be part of Micron's NAND Center of Excellence in Singapore, enhancing supply chain resiliency and fostering innovation through co-located R&D and manufacturing [3] - Micron's expansion is expected to strengthen Singapore's semiconductor ecosystem and position it as a critical node in the global semiconductor supply chain, leveraging growth in AI [6] Group 3: Technological Advancements - The new fab will utilize advanced robotic automation and smart manufacturing technologies to enhance efficiency and innovation [6] - Micron's investment will also focus on building a future-ready semiconductor workforce through collaborations with academia, offering internships and upskilling opportunities in AI and smart manufacturing [7]