高测股份：公司目前批量供应的硅片主流厚度仍以100-130μm为主

Core Viewpoint - The company is focusing on the development and supply of ultra-thin silicon wafers, with a current mainstream thickness of 100-130μm and capabilities for 60-80μm and 50μm wafers, responding to market demand from leading battery customers and research institutions [1] Group 1 - The company has the ability to deliver small batches of 60-80μm silicon wafers and has introduced 50μm ultra-thin silicon wafers [1] - There is a growing demand for 50μm silicon wafer samples from several leading battery customers and research institutions [1] - The application of ultra-thin silicon wafers is expected to expand with the use of ultra-thin flexible HJT batteries in space photovoltaic systems [1] Group 2 - The company has laid out a technology roadmap for improving the yield of ultra-thin silicon wafers [1] - Continuous technological innovation will be a key strategy for the company to accelerate the mass production of ultra-thin silicon wafers in the industry [1]