高测股份：公司已具备小批量交付60-80μm硅片能力

Core Viewpoint - The company is focusing on the photovoltaic silicon wafer cutting segment, leveraging its "equipment + consumables + process" technology closed-loop advantage to lead the thin wafer trend in the industry [1] Group 1: Product Development - In 2022, the company launched an 80μm ultra-thin silicon wafer, followed by a 60μm ultra-thin silicon wafer in 2023, and recently introduced a 50μm ultra-thin silicon wafer [1] - The mainstream thickness for mass-produced silicon wafers remains between 100-130μm, but the company has developed the capability for small batch delivery of 60-80μm silicon wafers [1] Group 2: Market Demand - Several leading battery customers and research institutions have requested sample testing for the 50μm silicon wafers, indicating a growing interest in ultra-thin silicon wafers [1] - The application of ultra-thin silicon wafers is expected to expand with the use of flexible HJT (Heterojunction Technology) solar cells in space [1] Group 3: Technical Challenges and Innovations - The scaling of ultra-thin silicon wafer cutting technology presents significant technical barriers, requiring advanced cutting equipment, diamond wire, and cutting processes [1] - The company has planned a pathway to continuously improve the yield of ultra-thin silicon wafers, supporting the industry's efforts to accelerate mass production [1] - The company is also closely monitoring cutting-edge technologies such as perovskite and has actively laid out related product developments [1]