盛美上海：公司重点推出的面板级先进封装的新设备包括Ultra ECP ap-p面板级电镀设备等三款新产品

Core Viewpoint - The company is focusing on launching advanced panel-level packaging equipment, including three new products aimed at enhancing manufacturing efficiency and reducing contamination risks in the semiconductor industry [1] Product Innovations - The UltraECPap-p panel-level electroplating equipment utilizes a patented horizontal electroplating method that synchronizes the square electric field with the panel, improving electroplating uniformity and reducing chemical cross-contamination risks between different metal plating baths [1] - The UltraCvac-p panel-level negative pressure cleaning equipment employs negative pressure technology to remove flux residues from chip structures, significantly enhancing cleaning efficiency by allowing cleaning solutions to reach narrow gaps; this equipment is already in mass production at client sites [1] - The UltraCbev-p panel-level edge etching equipment is designed specifically for edge etching and copper residue removal, playing a crucial role in fan-out panel-level packaging technology [1] Market Strategy - The company aims to actively promote the application and expansion of these three product types in the Taiwan market, while also focusing on the development trends in the panel-level equipment market [1] - The company expresses confidence in opening up the wafer-level packaging equipment market in Taiwan this year [1]