兴森科技：公司与主要客户的合作均正常推进，随着扩产产能的释放，CSP封装基板业务的规模有望进一步提升

Core Viewpoint - The company, Xingsen Technology, is progressing normally in its collaborations with major clients, and the expansion of production capacity is expected to further enhance the scale of its CSP packaging substrate business [2] Group 1 - The company confirmed that its cooperation with major clients is proceeding smoothly [2] - The release of expanded production capacity is anticipated to boost the scale of the CSP packaging substrate business [2]