Core Viewpoint - Jie Mei Technology has highlighted its strong technical foundation in low roughness MLCC release films, which aligns well with the performance requirements of HVLP copper foil and PCB carrier copper foil [1] Group 1: Company Insights - Jie Mei Technology is currently in the process of evaluating the performance of HVLP copper foil, which has entered the sample submission phase for South Korea's Doosan [1] - The testing cycle for the new product samples depends on the evaluation results from the customers [1] Group 2: Industry Context - Roushen Technology has mastered the large-scale preparation technology for ultra-thin film materials, with extensive experience in copper vapor deposition, magnetron sputtering, and electroplating [1]
洁美科技：柔震科技掌握了超薄膜材规模化的制备技术