奥士康拟投资18.2亿元用于高端印制电路板项目

Core Viewpoint - Aoshikan Technology Co., Ltd. plans to issue convertible bonds to raise up to 1 billion yuan for a high-end PCB project, which aims to optimize product structure and enhance competitiveness in response to growing market demands [1][3]. Group 1: Company Overview - Aoshikan is a leading player in the domestic PCB industry, already possessing production capabilities for high-frequency, high-speed, and high-density interconnect PCBs [2]. - The company is currently facing capacity bottlenecks in the high-end PCB sector, which limits its ability to meet the rapidly growing demand from downstream markets [3]. Group 2: Industry Trends - The PCB industry is evolving due to technological advancements and manufacturing process iterations, focusing on meeting complex circuit layouts and high-performance computing needs [2]. - The demand for high-end PCB products, such as high multilayer boards and high-density interconnect boards, is surging due to the rapid expansion of computing infrastructure driven by artificial intelligence and the acceleration of electric and intelligent vehicle development [1][2].