内资上市PCB大厂超18亿布局HDI
Sou Hu Cai Jing·2026-02-02 14:07

Group 1 - Company plans to invest 1.82 billion yuan in high-end printed circuit board (PCB) project, aiming to enhance product structure and core competitiveness to meet the growing demand in emerging sectors [1][2] - The project will focus on the production capacity of high-layer boards and HDI boards, targeting an annual output of 840,000 square meters, which are essential for applications in AI infrastructure, smart electric vehicles, and other emerging fields [1][2] - The investment is expected to address the capacity shortfall in high-end PCB products, increasing the proportion of high-value-added products and reducing reliance on mid-to-low-end products [2] Group 2 - The PCB industry is experiencing a "low-end surplus, high-end shortage" situation, driven by rapid growth in AI, new energy vehicles, and 5G/6G sectors, presenting significant development opportunities [2] - The competitive landscape is increasingly polarized, with leading companies like Shenzhen South Circuit, Huadian Technology, and Shenghong Technology making technological breakthroughs in high-end PCBs, while smaller firms focus on mid-to-low-end markets [2] - The industry is accelerating its transition towards high-end, green, and intelligent manufacturing, where technological research and development capabilities and environmental standards are becoming key competitive advantages [2][3]

内资上市PCB大厂超18亿布局HDI - Reportify