存储双巨头加快NAND产线转换投资

Core Viewpoint - Samsung Electronics and SK Hynix plan to initiate cutting-edge NAND flash production line conversion investments in Q2 2026 to address the surge in NAND market demand driven by the AI industry [1][2]. Group 1: Samsung Electronics - Samsung has commenced mass production of 280-layer V9 NAND flash in September 2024, but current capacity is limited to approximately 15,000 wafers per month [1]. - The company initially deployed the early production line in Pyeongtaek due to insufficient market demand [1]. - Starting in Q2 2026, Samsung will focus on converting the Xi'an X2 production line, which currently produces 6th to 7th generation NAND, while the conversion of the neighboring X1 line to 8th generation NAND is nearly complete [1]. Group 2: SK Hynix - SK Hynix plans to advance the conversion of the 321-layer 9th generation NAND production line at its Cheongju M15 factory in Q2 2026, aiming to increase its current monthly capacity from 20,000 wafers to approximately 30,000 wafers [2]. - The conversion investment is expected to reach a monthly capacity of 40,000 to 50,000 wafers for the new NAND products, with a ramp-up phase anticipated in 2027 [2]. Group 3: Industry Trends - Both companies have previously focused their equipment investments on the DRAM sector, but are now accelerating capacity adjustments in response to the tightening supply in the NAND flash market [4].