Group 1 - The company, Lanqi Technology, plans to set the upper limit of its IPO price range, with a maximum offering price of HKD 106.89, aiming to raise up to HKD 7.04 billion [1] - The IPO will take place from January 30 to February 4, with 65.89 million H-shares being issued, 10% for public offering in Hong Kong and the remainder for international placement, along with a maximum of 15% over-allotment option [1] - Lanqi Technology is a leading fabless integrated circuit design company, focusing on innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure, projected to be the largest memory interconnect chip supplier globally by revenue in 2024, with a market share of 36.8% [1] Group 2 - The company offers a full range of memory interface chips from DDR2 to DDR5, including supporting chips such as SPD, temperature sensors, and power management ICs, with its DDR5 memory interface chips being critical for stable data transmission between CPUs and DRAM modules in servers [2] - New interconnect chips launched by the company aim to enhance the reliability and efficiency of data transmission in AI servers and personal computers [2] - The company has two main product lines: interconnect chips and Zindai products, with interconnect chips including memory interface chips, supporting chips, PCIe/CXL interconnect chips, and clock chips [2]