USC(SH:688403) Xin Lang Cai Jing·2026-02-03 07:52Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is actively expanding its business in advanced packaging and testing services for integrated circuits, particularly in response to the growing demand for storage chips in the AI infrastructure era [2][3]. Group 1: Business Developments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and established a strategic partnership with its shareholder, East China Technology (Suzhou) Co., Ltd., to jointly develop 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2][3]. Group 2: Financial Performance - For the period from January to September 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [9]. - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. Group 3: Market Position and Shareholder Information - As of September 30, 2025, the company had 23,500 shareholders, an increase of 15.93% from the previous period, with an average of 36,445 circulating shares per shareholder, up 27.82% [9]. - The company is listed in the electronic-semiconductor-integrated circuit packaging and testing sector, with its main revenue derived from display driver chip packaging, which constitutes 90.25% of its total revenue [8].