清华大学团队研发柔性AI芯片，将填补相关领域空白

Group 1 - Tsinghua University's research team has developed a flexible AI chip named FLEXI, designed for edge intelligence acceleration, filling a gap in flexible electronics technology [1] - FLEXI chip is manufactured using low-temperature polycrystalline silicon CMOS technology, offering advantages such as lightweight, low cost, and high energy efficiency [1] - The chip can withstand over 40,000 bending cycles at a radius of 1mm and 180° folding without significant performance degradation, demonstrating stability under high-frequency computing and extreme mechanical stress [1] Group 2 - The flexible chip industry is expected to undergo industrialization, with projections indicating that the global flexible electronics market could grow from $85 billion to over $173 billion between 2025 and 2030 [1] - China's flexible chip industry is anticipated to increase from 50 billion yuan to 150 billion yuan, with a compound annual growth rate exceeding 25% [1]