通富微电：公司去年在光电合封（CPO）领域的技术研发取得突破性进展，相关产品已通过初步可靠性测试

Core Viewpoint - The company is positioned as one of the few domestic packaging and testing enterprises with capabilities in HBM packaging and CPO silicon photonic packaging, highlighting its competitive edge in the AI computing packaging sector [1] Group 1: Technology and Innovation - The company has achieved significant breakthroughs in the field of optical-electrical co-packaging (CPO) by 2025, with related products passing initial reliability tests [1] - The self-developed thermal management technology addresses high-end computing power challenges, enhancing the company's technological advantage [1] Group 2: Market Position and Client Considerations - The technological advantages in CPO are becoming a core consideration for leading computing power clients in their collaboration decisions [1] - Future developments will be assessed based on customer and market demands, indicating a responsive approach to market needs [1]