永志股份IPO辅导备案，获毅达资本、新洁能投资，华泰联合保荐

Core Viewpoint - Jiangsu Yongzhi Semiconductor Materials Co., Ltd. has submitted a report for its initial public offering (IPO) and is being guided by Huatai United Securities [1][4]. Company Overview - Jiangsu Yongzhi Semiconductor Materials Co., Ltd. is located in Taizhou, Jiangsu Province, and is recognized as a national-level specialized and innovative "little giant" enterprise, primarily engaged in the research, production, and sales of semiconductor chip packaging materials, including lead frames and packaging substrates [1][4]. - The company was established on October 15, 2007, with a registered capital of 113.331472 million yuan [5]. Shareholding Structure - The controlling shareholder is Xiong Zhi, who directly holds 43.631775 million shares and controls an additional 5.834809 million shares through partnerships, totaling 49.466560 million shares, which accounts for 43.6477% of the company [1][5]. Financing History - Yongzhi has received investments from various institutions, including Yida Capital, New Energy, and Zhongjin Chuanhua Fund, with significant financing rounds including: - Series A in December 2021, raising hundreds of millions of yuan [2]. - Series B in August 2025, amount undisclosed [2]. IPO Guidance - The company signed a guidance agreement with Huatai United Securities on January 29, 2026, to assist in its IPO process [4][7]. - The guidance will include establishing internal control systems, financial management, and compliance with legal regulations [7][8].