汇成股份跌3.12%，成交额6.51亿元，今日主力净流入-4182.62万

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and forming a strategic partnership to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - The company's main business involves high-end packaging and testing services for integrated circuits, with a revenue composition of 90.25% from display driver chip packaging [3][8]. Group 2: Financial Performance - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, reflecting a year-on-year growth of 21.05%, and a net profit of 124 million yuan, up 23.21% year-on-year [9]. - The overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4][9]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. Group 3: Market Position and Trends - The company operates within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is categorized under advanced packaging and semiconductor concepts [8]. - The stock experienced a decline of 3.12% on February 10, with a trading volume of 651 million yuan and a market capitalization of 16.206 billion yuan [1].