江波龙：mSSD采用Wafer级系统级封装，实现轻薄化、紧凑化并保持相当性能水平

Core Viewpoint - The company Jiangbolong has introduced a new mSSD product that utilizes Wafer-level System-in-Package (SiP) technology, integrating multiple components into a single package, which significantly reduces manufacturing costs and enhances product performance [1] Group 1: Product Innovation - The mSSD product integrates the main controller, NAND, and PMIC into a single package, eliminating multiple SMT processes such as PCB mounting and reflow soldering [1] - This integration leads to a lightweight and compact design, meeting low power consumption requirements while occupying less space [1] - The performance of the new mSSD remains comparable to traditional SSDs, with improved physical characteristics [1]