盛合晶微科创板IPO2月24日上会

Group 1 - The core point of the article is that Shenghe Jingwei Semiconductor Co., Ltd. is set to undergo an IPO review on February 24, aiming to raise approximately 4.8 billion yuan for advanced packaging projects [1] - Shenghe Jingwei is a leading global provider of integrated circuit wafer-level advanced packaging services, focusing on 12-inch silicon wafer processing and offering wafer-level packaging (WLP) and multi-chip integration packaging [1] - The company aims to enhance the performance of high-performance chips, particularly GPUs, CPUs, and AI chips, through heterogeneous integration methods that exceed Moore's Law, achieving improvements in computing power, bandwidth, and energy efficiency [1] Group 2 - The IPO application was accepted on October 30, 2025, and entered the inquiry stage on November 14 of the same year [1] - The funds raised will be allocated to projects including three-dimensional multi-chip integration packaging and ultra-high-density interconnect three-dimensional multi-chip integration packaging [1]