兴森科技：公司FCBGA封装基板主要用于CPU、GPU、FPGA、ASIC等高算力芯片领域

Group 1 - The company, Xingsen Technology, stated that its FCBGA packaging substrates are primarily used in high-performance chip fields such as CPU, GPU, FPGA, and ASIC [2] - The CSP packaging substrates are mainly utilized in storage and RF chip sectors, with an overall production capacity of 50,000 square meters per month [2] - The previous capacity of 35,000 square meters per month has reached full production, and the new expansion of 15,000 square meters per month is progressing rapidly [2] - The overall industry demand is currently strong, and future expansion plans will depend on market demand [2]