中微半导：拟将募投项目结项，12083.43万元节余资金用于永久补充流动资金

Core Viewpoint - The company has completed three major projects related to chip development and has approved the conclusion of these projects during the board meeting held on February 11, 2026 [1] Group 1: Project Completion - The company announced the completion of the "Home Appliances and Industrial Control MCU Chip Development and Industrialization Project," "IoT SOC and Analog Chip Development and Industrialization Project," and "Automotive Grade Chip Development Project" [1] - All three projects have been implemented and reached the predetermined usable status as of December 31, 2025 [1] Group 2: Financial Summary - As of December 31, 2025, the total surplus of raised funds from the three projects amounts to 220.8343 million yuan, after deducting payable amounts of 2.8309 million yuan [1] - Out of the surplus funds, 120.8343 million yuan is intended for permanent replenishment of working capital, while 100 million yuan is earmarked for investment in new projects [1] - Following the transfer of the raised funds, the relevant special account for the raised funds will be canceled [1]