江波龙(301308.SZ)：已推出Wafer级系统级封装（SiP）的mSSD、超薄ePOP4x、超小尺寸eMMC等创新型产品
Shenzhen Longsys Electronics Shenzhen Longsys Electronics (SZ:301308) Ge Long Hui·2026-02-11 13:16

Core Viewpoint - Jiangbolong (301308.SZ) possesses market-leading high-end SiP technology and multi-chip packaging (MCP) technology, which supports the development of innovative products such as wafer-level system-in-package (SiP) mSSD, ultra-thin ePOP4x, and ultra-small eMMC [1] Group 1 - The company has launched innovative products including mSSD, ultra-thin ePOP4x, and ultra-small eMMC, leveraging its advanced packaging technologies [1] - The leading packaging technology plays a crucial role in supporting high-end products [1] - Customized edge AI storage products have achieved mass shipments with major clients [1] Group 2 - mSSD is being rapidly adopted by several leading PC manufacturers [1]