连续取得多项创新技术突破 振芯科技加快构建“云、网、群、端、智”全体系发展格局

Core Viewpoint - The company Zhenxin Technology has launched several leading products and solutions in the integrated circuit and Beidou navigation sectors, including the GM5900A digital multi-beam synthesis chip, the integrated high-definition visual intelligent processing platform, and the ZH-SC001 core product using new SiP technology [2][9]. Group 1: GM5900A Digital Multi-Beam Synthesis Chip - The GM5900A chip is a 32 receive and 32 transmit Digital Beam Forming (DBF) chip designed to meet the demands of large LEO satellite constellations from companies like SpaceX and OneWeb [3]. - The chip features high integration, being only 1/4 the area of an FPGA while incorporating various modules such as SerDes receivers and transmitters, DDC, DUC, and health management circuits [3]. - It allows for flexible configuration and easy operation through an SPI interface, enabling quick adjustments to bandwidth, effective bits, interface rates, and beam numbers without programming [4]. - The GM5900A supports a maximum instantaneous bandwidth of 1GHz and can synthesize up to 16 beams, meeting high data throughput requirements [4][5]. Group 2: Integrated High-Definition Visual Intelligent Processing Platform - The platform integrates various core components to provide a real-time AI processing solution for intelligent visual data, covering acquisition, transmission, computation, and control [6]. - It supports input from 12 camera video signals at up to 4K@60fps, ensuring low-latency transmission and compliance with automotive quality standards [7]. - The platform boasts 16 TOPS@INT8 AI computing power, enabling real-time recognition and tracking of high-definition video images [7]. Group 3: ZH-SC001 Core Product Using SiP Technology - The ZH-SC001 is a general-purpose mixed-signal SiP that integrates multiple functional chips and passive components, focusing on mid-to-high-end RF applications [9][10]. - It offers advantages such as low power consumption, small size, and a short product development cycle, suitable for low-orbit satellite communications and compact airborne devices [10]. - The company provides customized SiP products based on client needs, enhancing development efficiency and reducing costs [10][11].