世运电路芯片内嵌技术2026年投产,泰国项目与AI业务同步推进

Core Viewpoint - The company is making significant advancements in technology, production capacity, and business expansion, particularly in the PCB sector for applications in electric vehicles and data centers [1] Group 1: Technology Developments - The company is set to begin production of embedded PCB packaging technology by mid-2026, aimed at optimizing system performance and reliability [1] - The company has completed technical certification in the aerospace sector and is collaborating with core clients to advance product delivery [1] Group 2: Capacity Expansion - The company is investing 520 million yuan in a high-end PCB project in Thailand, with a planned capacity of 1.2 million square meters to enhance its global layout [1] Group 3: Business Partnerships and Demand - Strong demand in the energy storage sector has resulted in full order books, with collaborations established with leading international clients such as Tesla [1] - The company has entered the supply chain systems of Nvidia and AMD, participating in the research and certification of next-generation products [1]

OLYMPIC-世运电路芯片内嵌技术2026年投产,泰国项目与AI业务同步推进 - Reportify