华正新材(603186.SH)：公司的BT封装材料和CBF积层绝缘膜适用于FC-BGA等各类先进封装工艺

Group 1 - The core viewpoint of the article is that Huazheng New Materials (603186.SH) has confirmed that its BT packaging materials and CBF laminated insulation films are suitable for various advanced packaging processes, including FC-BGA [1] Group 2 - The company is actively engaging with investors through an interactive platform to provide insights into its product applications [1] - The mention of advanced packaging processes indicates the company's focus on innovation and adaptation to industry trends [1] - The specific reference to FC-BGA highlights the relevance of the company's products in the semiconductor packaging market [1]